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Test Socket

Test Socket

A test socket is one of the components used in the final test process after packaging for ICs. It requires optimal materials and proficiency in manufacturing for performance, even in extreme test environments. We can design and manufacture Test Sockets suitable for the customer’s environment, keep thorough quality control, and provide high-quality services.

WAFER LEVEL TEST

 

Developed with innovative and powerful WLCSP test technology, this product guarantees high test yields for the key parts of ever-evolving smart devices. This is also a reliable solution for the development environment to generate demand for more detailed and precise processes.
Experience the top-quality wafer level test solution.

Key points

  • Low contact resistance
  • Design to secure strength based on structural analysis
  • Materials with high durability for temperature and humidity change
  • Quality improvement through precision processing
  • Convenient maintenance
  • Ceramic materials applied
  • Excellent signal integrity

UNIVERSAL TEST

 
 

Typе Characteristics

  • Application of solutions developed on the basis of extensive data
  • Application of premium materials to minimize deformation
  • Quality stability ensured through detailed measurements and precision processing
  • Precise location decision simulation
  • Device floating guide and device guide solution provided
  • Structural analysis simulation
  • Sn transition delay solution through special coating

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force

Initial Force
Recommended Stroke
Full Stroke
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
200K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ