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History

HISTORY

2023

2023. 09. Signed a government project for smart factory construction

2023. 09. Joined SEMI(Semiconductor Equipment and Materials International) to expand overseas market

2021

2021. 12. Industrial R&D Center Authorization (Korea Industrial Technology Association)

2020

2020. 03. INNO-BIZ Certification (Ministry of SMEs and Startups)

2016

2016. 01. Registered as a partner company of KCC.

2016. 03. Registered as a partner company of Samsung Electro-mechanics

2016. 12. Quality Management System Certification (ISO 9001:2015)

2015

2015. 03. NEW-SEE TECH Establishment

2015. 07. Registered as a partner company of Daedeock Electronics

2015. 07. Registered as a partner company of SIMMTECH

2014

2014. 03. Business and Technology Review

2014. 07. Facility Order

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force

Initial Force
Recommended Stroke
Full Stroke
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
200K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ