CNC Drilling Spec
![](https://newseetech.co.kr/storage/app/public/thumbnails/8e/f9/spill_800x800_936eea9baab4107293d2e05de651d1776e14ace4.png)
Circle | |
---|---|
Minimum wall | 10㎛ |
Minimum hole size | 35㎛ |
Material | Machinable Ceramic, S-1000, MDS-100 |
Product
Vertical Probe Card, WLCSP Device
![](https://newseetech.co.kr/storage/app/public/thumbnails/72/f4/spill_800x800_1e4c50beb0f5ad27154e8f61907fa874abf454d6.jpeg)
![](https://newseetech.co.kr/storage/app/public/thumbnails/c5/d7/spill_800x800_5baf13ae09c9a9049ccf3ee38fd063fcfbc3b057.jpeg)
WAFER LEVEL TEST SOCKET
WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.
주요사항
LOGIC TEST SOCKET
Spring Force |
Initial Force
Recommended Stroke
Full Stroke
|
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf
|
Material Spec |
Barrel
Top Plunger
Bottom Plunger
Spring
|
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated
|
Mechanical Spec |
Pointing Accuracy
Operating Temperature
Spring Life Expectancy
|
± 50um
-25°C ~ +125°C
200K <
|
Electrical Spec |
DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
|
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF
|
* 항목이 많으면 좌우 스크롤이 가능합니다.
WAFER LEVEL TEST SOCKET
WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.
주요사항