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Pogo Pin

Pogo Pin

Pogo pins are utilized for manufacturing pogo-type sockets for the packaged ICs test. The tip of the pogo pin is made into various types depending on the shape of the test object, such as balls and pads, and we supply the optimal pin type that meets the customer’s needs.

 

Pogo Pin Tip Shape


 

kv type : OS03VC-F5.3



Spring Force

Initial Force
Recommended Stroke
Full Stroke
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
200K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF

* Please scroll the page left and right to see contents from the sides.

kv type : OS03VR-F10.1

Spring Force

Initial Force
Recommended Stroke
Full Stroke
4.0gf
0.50mm @ 24.0gf
0.65mm @ 30.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
SK4 / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
300K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<100mΩ
1.5 amps continuous
-1 dB @ 10.43 GHz
1.14nH
0.57pF

* Please scroll the page left and right to see contents from the sides.

k type : OS03VA-F4.53


Spring Force

Initial Force
Recommended Stroke
Full Stroke
2gf
0.30mm @ 10.0gf
0.60mm @ 20.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
300K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<70mΩ
2 amps continuous
-1 dB @ 16.80 GHz
2.27nH
0.83pF

* Please scroll the page left and right to see contents from the sides.

k type : OS03VA-F3.4


Spring Force

Initial Force
Recommended Stroke
Full Stroke
3gf
0.60mm @ 10.0gf
0.70mm @ 12.5gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
300K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<60mΩ
2 amps continuous
-1 dB @ 12.47 GHz
1.12nH
0.58pF

* Please scroll the page left and right to see contents from the sides.

Barreless type : OD08CR-F4.0


Spring Force

Initial Force
Recommended Stroke
Full Stroke
0gf
0.70mm @ 40.0gf
0.80mm @ 43.5gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
-
Becu / Gold plated
Becu / Gold plated
SUS / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-55°C ~ +155°C
300K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<120mΩ
3 amps continuous
-1 dB @ 20.23 GHz
1.10nH
0.67pF

* Please scroll the page left and right to see contents from the sides.

Barreless type : OD03CA-P5.85


Spring Force

Initial Force
Recommended Stroke
Full Stroke
0gf
0.65mm @ 23.0gf
0.80mm @ 28.5gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
-
SK4 / Gold plated
SK4 / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 80um
-25°C ~ +125°C
300K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<120mΩ
1.2 amps continuous
-1 dB @ 8.71 GHz
0.89nH
0.73pF

* Please scroll the page left and right to see contents from the sides.

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force

Initial Force
Recommended Stroke
Full Stroke
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
200K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ