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Company Overview

CEO Greetings

We would like to express our sincere gratitude to all our customers for visiting our website.

 

Based on our parent company's 20+ years of BBT(Bare Board Test) experience in the PCB industry, we are creating synergy effects through active R&D and investment in the production of PCB Test Fixtures.

 

Furthermore, we continuously strive to provide more advanced products and value to our customers by expanding our business area to the semiconductor test industry, including manufacturing and supplying test sockets and pogo pins and strictly managing product quality.

 

NEW-SEE TECH thoroughly operates our business with a customer-centric approach, and we will constantly pursue quality innovation and invest in R&D for new product development. Also, in line with the ESG era, we will grow as a company that fulfills its social responsibilities, including ethical management, eco-friendly management, and social contribution. Thank you.

Overview

 
  • Established

    2015. 03.

  • CEO

    Jung Hee Woo

  • Major Business Area

    PCB Test Fixture : Wire / MEMS Probe Fixture

    Test Socket : FCCSP, BGA, etc.

    Pogo Pin, Mems Pin for Semiconductor Test

    CNC and Laser Machining Services

  • Location

    ADDRESS 4, Techno 3-ro, Yuseong-gu, Daejeon, Republic of Korea

    TEL+82.42.934.1601

    FAX+82.42.934.1602

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ

LOGIC TEST SOCKET

Spring Force

Initial Force
Recommended Stroke
Full Stroke
2.5gf
0.70mm @ 15.5gf
0.90mm @ 19.0gf

Material Spec

Barrel
Top Plunger
Bottom Plunger
Spring
PBT / Gold plated
SK4 / Gold plated
Becu / Gold plated
SWP / Gold plated

Mechanical Spec

Pointing Accuracy
Operating Temperature
Spring Life Expectancy
± 50um
-25°C ~ +125°C
200K <

Electrical Spec

DC Resistance (Avg)
Current Rating
Band Width
Self Inductance
Capacitance
<80mΩ
2 amps continuous
-1 dB @ 18.11 GHz
0.93nH
0.52pF

* 항목이 많으면 좌우 스크롤이 가능합니다.

WAFER LEVEL TEST SOCKET

 

WLCSP stands for Wafer-Level Chip-Scale Package, a type of integrated |cir cuit package designed to be mounted dir ectly on a printed circuit board |(PCB) without a board.

주요사항

  • 최소 pitch 0.08mm
  • 하중: 3gf~ tgf
  • Socket 소재:엔지니어링 플라스틱과 세라믹
  • 낮은 단가 제작 가능
  • 뛰어난 내구성 (100만 사이클 이상)
  • 빠른 납기일정:2주이내
  • 접촉저항: 10mΩ to 100mΩ